- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 43/24 - Assembling by moulding on contact members
Patent holdings for IPC class H01R 43/24
Total number of patents in this class: 795
10-year publication summary
66
|
55
|
65
|
79
|
84
|
64
|
80
|
50
|
43
|
12
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1034 |
58 |
Yazaki Corporation | 6282 |
55 |
Sumitomo Wiring Systems, Ltd. | 9367 |
53 |
Sumitomo Electric Industries, Ltd. | 14131 |
27 |
Amphenol Corporation | 748 |
27 |
AutoNetworks Technologies, Ltd. | 5809 |
27 |
Dongguan Luxshare Technologies Co., Ltd. | 191 |
25 |
Robert Bosch GmbH | 40953 |
21 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
20 |
Apple Inc. | 50209 |
16 |
Hirose Electric Co., Ltd. | 325 |
15 |
Japan Aviation Electronics Industry, Limited | 1585 |
15 |
Molex, LLC | 1792 |
9 |
Phoenix Contact GmbH & Co. KG | 2202 |
9 |
TE Connectivity Solutions GmbH | 2580 |
9 |
TE Connectivity Germany GmbH | 655 |
8 |
Lotes Co., Ltd. | 346 |
7 |
Vicor Corporation | 121 |
7 |
Aptiv Technologies AG | 2097 |
6 |
Hon Hai Precision Industry Co., Ltd. | 4157 |
5 |
Other owners | 376 |